|
週次 |
日期 |
單元主題 |
|
第1週 |
2/25 |
Semiconductor Technology Overview & Outlook |
|
第2週 |
3/04 |
Si Technology Overview - CMOS technology introduction and scaling challenges |
|
第3週 |
3/11 |
Si Technology Overview - More-Than-Moore Silicon Technologies |
|
第4週 |
3/18 |
Process Module - Advanced Patterning & Lithography Process |
|
第5週 |
3/25 |
Process Module - Advanced etching process |
|
第6週 |
4/01 |
Process Module - Advanced thin film and CMP Process |
|
第7週 |
4/08 |
Process Module - Advanced Ion implantation and diffusion process |
|
第8週 |
4/15 |
Fabrication Process Integration - Integration Background
Non-logic Process Integration + FEOL |
|
第9週 |
4/22 |
Midterm Exam |
|
第10週 |
4/29 |
Fabrication Process Integration - Logic Process Integration + BEOL |
|
第11週 |
5/06 |
Packaging - 1.Testing Concept 2.SOC and 3D SOC Testing |
|
第12週 |
5/13 |
Packaging - 1.Advanced Si Packaging Introduction 2.SOC and 3D IC Packaging Technology Migration |
|
第13週 |
5/20 |
Device Modeling - 1.Critical features and components in device compact modeling 2.Statistical modeling 3.Interconnect modeling 4.RF device modeling |
|
第14週 |
5/27 |
Circuit Design - 1.Physics of analog design 2.Analog building blocks 3.ADC as an example |
|
第15週 |
6/03 |
Circuit Design - 1.ESD tutorials 2.The challenges of multi-GHz designs |
|
第16週 |
6/10 |
Circuit Design - 1.TSMC Open Innovation Platform 2.ASIC Design Flow Introduction 3.TSMC Reference Design Flow 4.Advanced topics and case study |
|
第17週 |
6/17 |
Class wrap up - Presentation of group study |
|
第18週 |
6/24 |
Final Exam |